With its compact design and use of a Clean Air insulation medium, the NXPLUS C 24 – blue GIS is a single-busbar switchgear for the primary distribution level of up to 24 (or 15) kV, 25 kA, 125 (95) kV BIL, 2500 A busbar current, and 2000 A feeder current. The switchgear features a hermetically sealed stainless steel pressure vessel, vacuum switching technology, and a digital protection system. Together, these elements help ensure enhanced durability, protection against industrial contamination, and a longer operational lifespan.

Engineered with the highest standards for safety in mind, as well as for minimal maintenance and environmental independence, the NXPLUS C 24 – blue GIS switchgear meets IEC, ANSI/IEEE, and CSA standards. It is commercially available in the US through Siemens sales offices.

For more information, visit siemens.com.

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Increasingly complex products require seamless collaboration across various disciplines within product development. Connecting electronic CAD (ECAD) and electronic design automation (EDA) systems to PLM prevents the risk of isolated data silos and miscommunication between departments. With the new interface to Altium Designer in its Elements platform, CONTACT Software ensures that all departments have access to consistent, up-to-date information, keeping the development process running smoothly.

Users can compile component libraries with their respective parts and metadata in CIM Database and export them via Workspaces Desktop. The downloaded workspace includes all relevant information for an Altium component library, allowing engineers to work with these parts in their Altium Designer projects seamlessly. Each part retains its ID defined in CIM Database, such as the part number. The article can therefore be identified across all three systems and the installation information can be traced at any time.

CONTACT Elements also supports loading existing Altium projects directly from the PLM or creating templates to serve as starting points for new projects. Conversely, users can also save their Altium projects back into the PLM. With a single click, Workspaces Desktop transfers all project information to the PLM system as a document and attaches it to the relevant part of the printed circuit board (PCB) or its assembly variants.

Assembly variants are standalone parts in the form of assemblies. They consist of components and a PCB combined in the product structure or bill of materials. As part of a larger product, PCBs can also be linked with other assembly variants within the mechatronic product structure, for example from the MCAD system. This provides centralized access to the fully connected product information.

For more information, visit contact-software.com.

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‍A New Era of Metal Additive Manufacturing

‍By integrating Dyndrite’s LPBF Pro software, Nikon SLM Solutions’ customers gain access to advanced toolpath strategies that maximize the capabilities of the open-architecture SLM platform. This partnership introduces next level capabilities, such as scalable slicing, low-angle support-free printing, optimized multi-laser coordination, and on-the-fly laser manipulation, enhancing productivity, and part quality for industrial-scale additive manufacturing.Moreover, manufacturers can develop their own intellectual property (IP), toolpath innovations, and optimized multi-optic laser allocations for their unique needs, making this the ultimate solution for pushing the boundaries of engineering in the aerospace, automotive, defense, energy, and medical industries.

‍Open Architecture as a Catalyst for Progress

‍The collaboration underscores the strategic importance of open architecture in advancing metal additive manufacturing. By providing users with unmatched flexibility and control, this partnership empowers manufacturers to push industry boundaries and achieve unprecedented levels of innovation. Open architecture fosters a collaborative ecosystem where hardware and software solutions evolve together, creating greater opportunities for advancements and breakthroughs.

“This partnership between Nikon SLM Solutions and Dyndrite represents a milestone for industries where metal additive manufacturing is essential to achieving high-performance, differentiated parts,” said Simone Castellani, chief technology officer, Nikon SLM Solutions. “Our combined commitment to open architecture provides customers with unparalleled access to capabilities that drive innovation, fast-track production, and maximize efficiency across the entire process. Ultimately, our customers benefit the most by reducing time-to-market and achieving lower end-part costs.”

“Our collaboration with Nikon SLM Solutions represents a game-changer for the metal additive manufacturing industry that has been years in the making,” said Harshil Goel, CEO of Dyndrite. “Nikon SLM Solutions’ open architecture combined with Dyndrite’s compute and software capabilities delivers an unmatched solution for users seeking to dramatically increase build speed, improve part quality, or print without supports. We look forward to the array of new parts and part economics that have been fundamentally enabled due to our combined solution. If you are seeking to print inconel 718 and/or Titanium parts without supports come find us!”

‍Driving Industry Progress

‍The connecting of Dyndrite’s scalable compute architecture, advanced toolpath control, and customizable automation elevates Nikon SLM Solutions’ open, multi-laser systems to new levels of productivity. Customers gain capabilities to consistently produce complex geometries, including low-angle support-free builds, intricate features, and optimize multi-laser coordination.Nikon SLM Solution users will be able to harness:

• Scalable Compute: Dyndrite’s scalable compute architecture efficiently handles the massive data required to power Nikon SLM Solutions’ NXG family of 3D printers with their large 600 x 600 x 600/1500 mm build volumes. By leveraging Nvidia GPU acceleration and multi-threaded CPU processing, Dyndrite enables rapid processing of complex geometries. 
• Enhanced Toolpath Generation: Dyndrite LPBF Pro provides advanced toolpath capabilities that seamlessly integrate with Nikon SLM’s single and multi-optic laser systems, optimizing scan paths to accelerate build rates, print previously impossible parts such as intricate geometries, such as small features, thin walls, domes, and cantilevers, improve part quality and surface finish, and enable low-angle support-free builds.
• Advanced Multi-Laser Control: Through Nikon SLM’s open, multi-optic and focusing architecture, Dyndrite’s software is unmatched in ensuring optimal coordination between lasers, enabling the deployment of strategies that meet your production demands.
• Customization & Automation: Experience repeatable process automation through Dyndrite’s Python-based scripting language, allowing users to design critical manufacturing applications that automate complex workflows, shorten time for qualification, codifies knowledge and scales production.

Strategic Importance of Nikon SLM Solutions NXG and Dyndrite

By adding advanced support for Nikon SLM Solutions’ NXG in collaboration with Nikon SLM, Dyndrite continues to expand its footprint in the metal additive manufacturing space, further cementing its role as the go-to platform for forward-thinking manufacturers seeking advanced digital solutions.

The connection of Dyndrite’s software with Nikon SLM Solutions’ cutting-edge hardware highlights the companies’ shared mission to push industry limits while empowering customers to adopt best-in-class, adaptable solutions.

“Dyndrite shares our customer-centric vision,” said Dr. Simon Merkt-Schippers, EVP of product management at Nikon SLM Solutions. “Through open architecture and this partnership, we provide our customers access to the most powerful solutions available while supporting their specific needs, ultimately bringing low end-part costs and accelerated end-to-end production closer to reality.”

To learn more about Dyndrite LPBF Pro software, visit dyndrite.com/laser-powder-bed-fusion-app.

‍To learn more about Nikon SLM Solutions hardware, visit nikon-slm-solutions.com.

For more information, visit dyndrite.com.

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Renishaw’s TEMPUS technology, a new scanning algorithm for the RenAM 500 series of metal additive manufacturing (AM) systems, significantly boosts productivity without sacrificing part quality. This innovative technology enables the system’s lasers to fire while the powder recoater is still in motion, cutting up to nine seconds of build time from each layer. Given that builds often consist of thousands of layers, TEMPUS technology can reduce total build times by up to 50%, dramatically enhancing efficiency and throughput in high-volume production environments.

“We are thrilled to add support for Renishaw’s Tempus technology within our LPBF Pro platform. At Dyndrite our aim is to turbocharge our OEM partners’ hardware with advanced software. As we better integrate with hardware our customers benefit more and more from an optimized solution,” said Steve Walton, head of product at Dyndrite. “This integration enables the industry to achieve new levels of price and performance, opening 3D metal printing to new applications in additive manufacturing.

By integrating support for Renishaw’s Tempus technology, Dyndrite’s LPBF Pro empowers RenAM 500 series users with scriptable CAD-to-Print automation, advanced toolpathing tools for complex materials and process development, and streamlined quality and process controls. Through Dyndrite’s advanced toolpath control, users can print challenging parts—such as thin walls, cantilevers, and domes— while ensuring repeatable quality, and minimizing human error.

It also enables organizations to codify their additive manufacturing expertise, ensuring a smooth transition from development to full-scale part production. Dyndrite aims to further push the boundaries of what is possible with Tempus for large parts and geometric features through its combined solution.

“Renishaw’s Tempus technology is designed to push the boundaries of LPBF printing, and we’re excited to see it paired with Dyndrite’s powerful software capabilities,” said Kevin Brigden, applications engineering manager at Renishaw. “This collaboration continues to provide users with an even more efficient, reliable, and streamlined additive manufacturing process, making high-performance 3D printing accessible to a broader range of applications.”

If you’re a Renishaw user and interested in Dyndrite LPBF Pro, click here for more information.

For more information, visit dyndrite.com.

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Strategic Upgrade 

As U-tec’s parent company, Xthings will provide extensive support to elevate U-tec’s product and service offerings. This strategy encompasses:

• Data-Driven Product Optimization: Utilizing Xthings’ advanced data analytics capabilities, U-tec will gain deeper insights into consumer needs, driving superior product performance and functionality.
• New Product Launches: U-tec will introduce an expanded range of smart devices, including locks, doorbells, cameras, control systems, and personal electronic products, all powered by the Xthings IoT platform.
• Enhanced Compatibility through Connectivity Standards Alliance (CSA) Collaboration: By adopting the Matter standard, Xthings ensures its products are seamlessly compatible with leading platforms such as U home, Apple Home, Google Home, Amazon Alexa, and SmartThings, thereby enhancing user experiences.

Brand Revamp 

Since its inception, U-tec has earned market recognition for its innovative smart home solutions, including smart locks, cameras, and lighting control systems. With Xthings’ support, the brand revamp will include:

• Brand Image Refresh: A modernized logo and visual identity that reflect innovation and leadership in smart home and consumer electronics industry.
• Revised Brand Positioning: A renewed focus on providing smarter, safer, and more convenient home solutions while expanding its personal electronic consumer products.
• Enhanced Market Promotion: Through Xthings’ support, U-tec will bolster brand visibility and market penetration via multi-channel marketing initiatives.

Market Outlook 

This revamp and strategic upgrade underscore a deep synergy between technology and branding for Xthings and U-tec, reflecting the immense growth potential in the smart home market. Market projections indicate rapid expansion, with the global market size expected to reach $250 billion by 2028.

Matthew Brown, Xthings’ chief strategy officer, remarked, “We are excited to support U-tec’s brand transformation and strategic evolution. This initiative showcases our technological expertise and shared vision, as we remain committed to delivering smarter, better user experiences.”

For more information, visit xthings.com.

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All three devices in the new nRF54L Series integrate a 2.4 GHz radio and MCU functionality, including CPU, memory, and peripherals, into a single ultra-low power chip, supporting applications from simple, high-volume products to more demanding and advanced designs. Key applications include wearables, smart rings, gaming controllers, HID devices, as well as medical devices, smart homes, and industrial IoT products. The nRF54L15 is well-suited for more demanding applications, while the nRF54L10 and nRF54L05 target high-volume applications such as smart tags, electronic shelf labels, asset trackers, and other cost-sensitive IoT devices.

“The launch of the nRF54L Series is a proud moment for Nordic. This new range of wireless SoCs establishes Nordic, already the world’s leading supplier of Bluetooth LE solutions, firmly at the forefront of low power wireless technology,” says Oyvind Strom, EVP Short-Range with Nordic Semiconductor. 

Equipped for tomorrow’s advanced IoT products 

The nRF54L Series SoCs all feature an Arm Cortex-M33 processor clocked at 128 MHz and an ultra-low-power 2.4G Hz radio. They are designed to support advanced application software and wireless protocol stacks on a single chip, reducing the need for external MCUs or additional memory.  

Within the series, the nRF54L15 offers the largest memory capacity with 1.5 MB non-volatile memory (NVM) and 256 KB RAM, ideal for demanding applications. nRF54L10 provides a mid-range option with 1.0 MB NVM and 192 KB RAM, while the nRF54L05 is optimized for less demanding, cost-sensitive applications, featuring 0.5 MB NVM and 96 KB RAM. 

The product series offers up to 35 GPIOs and an ultra-compact 2.4 by 2.2 mm WLCSP package option that is 50 percent smaller than the comparable nRF52840. A range of nRF54L Series 6×6 pin-to-pin compatible QFN packages ensures design flexibility and manufacturing cost optimization.  

In addition to its expanded memory options, the product series integrates a low-power RISC-V coprocessor, supporting advanced application requirements without additional external components, reducing BOM costs, and enabling compact designs.

Enhanced multiprotocol support  

The nRF54L Series supports Bluetooth LE, Bluetooth Mesh, Thread, Matter, Zigbee, Amazon Sidewalk, and 2.4 GHz proprietary protocols, with enhanced capabilities such as up to 4 Mbps data rate. The series is future-proofed to support Bluetooth 6.0, including Bluetooth Channel Sounding. 

Next generation wireless SoCs 

The nRF54L Series takes the market-leading nRF52 Series to the next level, with even lower power consumption, double the processing power, and triple the processing efficiency. The new products are built on Nordic’s deep design expertise and include proprietary intellectual property (IP) such as low-leakage RAM and advanced radio technology. Ultra-low power capabilities and processing efficiency have been boosted by a pioneering transition to the 22 nm process node (TSMC’s 22ULL technology) while also significantly enhancing the resilience of Nordic’s supply chain. 

Development support and availability 

The new nRF54L15 DK (Development Kit) is available for order today, making the complete nRF54L Series – including the nRF54L10 and nRF54L05 – broadly accessible for evaluation and development. It comes with an ecosystem of software that quickly enables development and proof of concepts, combined with detailed documentation, hands-on online courses, and world-class technical support.  

nRF54L15 is sampling to selected customers now. nRF54L15, nRF54L10, and nRF54L05 will all enter full volume production towards the end of this year.

For more information, visit nordicsemi.com.

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Building Innovation is a premiere meeting for all who impact the built environment to find solutions. BI2025 takes place May 19-21, 2025, at the Ritz-Carlton Tysons Corner in McLean, Virginia.

The conference theme is Thrive: Strategies for Resilient Communities. The conference will follow three tracks: Leaders, Practitioners, and Technologists.

NIBS seeks speaker abstracts for the following topics:

• Functional recovery
• Sustainable design and construction practices
• Retrofitting for resilience
• Climate adaptation strategies for buildings and infrastructure
• Community resilience and engagement in urban planning
• Innovative materials
• Technologies for resilient design, construction, and planning
• Policy frameworks that support resilient development
• Adopting resilient projects and strategies; case studies
• Integration of green infrastructure and ecosystem services
• Risk assessment and management in the built environment
• Innovative investments and insurance in resilience
• Workforce

About the BI2025 Tracks

The three Building Innovation tracks aim to look beyond buildings to enable community-level resilience.

Leaders – Sessions will focus on developing policy frameworks, strengthening critical infrastructure, incentivizing the investment, and empowering the workforce behind functional recovery.

Practitioners – Establishing processes for resilient building, sessions will focus on codes, standards, existing buildings, risk assessment and management, and sustainable design and construction practices.

Technologists – Sessions will highlight current and emerging technologies for resilient design, construction, and planning, focusing on technology solutions, materials, use cases, and implementation and adoption.

Abstract submissions are due January 3, 2025.

For more information, visit nibs.org.

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“We are excited to show our project partners how Revizto can help teams in the construction process collaborate, communicate, and manage projects more efficiently. It takes our use of BIM to a whole new level, allowing us to work smarter and keep everyone on the same page.” – Brandon Nanke, director of VDC/BIM, Conlon Construction.

Conlon Construction, known for its expertise in construction management and a legacy of quality and schedule adherence, is advancing its use of technology to stay competitive. By leveraging building information modeling (BIM) and adopting Revizto as its Integrated Collaboration Platform, the firm is transforming how teams collaborate and coordinate across projects.

“From a preconstruction standpoint, Revizto will be a game-changer for our work with architects, engineers, project managers, and superintendents. By seeing changes in real-time, we can be sure that all stakeholders are informed and making sound decisions throughout the lifecycle of the project.” says Keefe Gaherty, vice-president of Preconstruction, Conlon Construction.

Since adopting Revizto in January 2023 through two proof-of-concept projects, Conlon quickly realized that Revizto is the key to advancing their BIM and VDC goals. Leveraging the model directly in the field will be critical to provide field teams with crucial timely data. For example, with Revizto, teams can verify that sleeves are correctly positioned before concrete is poured, preventing costly mistakes and project delays. This is just one of many ways Revizto will drive efficiency and value to Conlon’s projects.

“We are thrilled to welcome Conlon Construction to our fast-growing list of Enterprise customers. Conlon’s decision to adopt Revizto across its projects highlights their commitment to innovation and efficiency in the construction industry. By standardizing model-based coordination with a central integrated platform, they are positioning themselves to take on more complex projects and improve collaboration across their project teams. We look forward to supporting their growth and seeing the impact of this partnership on their diverse portfolio throughout the Midwest.” – Anthony Heller, Central Region sales director at Revizto.

For more information, visit revizto.com.

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The CoE, located at Cyient’s Manikonda Campus, will focus on developing next-generation magnetic sensors and power semiconductor products for the automotive industry. The state-of-the-art facility was inaugurated by Allegro MicroSystems president & CEO Vineet Nargolwala in the presence of Max Glover, senior vice president WW sales, Allegro MicroSystems, and Suman Narayan, senior vice president, products, Allegro MicroSystems.    

The CoE will house over 100 skilled engineers specializing in key areas such as post-silicon validation, design verification, analog design, analog mixed-signal verification, and embedded systems. This expansion significantly strengthens Allegro MicroSystems’s presence in India, providing access to a highly skilled talent pool and fostering collaboration within the vibrant Indian technology ecosystem.

The CoE will play a crucial role in accelerating the development of Allegro MicroSystems’s sensor and power integrated circuit (IC) product portfolios, which are essential components in electric vehicles, advanced driver-assistance systems (ADAS) and other automotive applications. By leveraging Cyient’s expertise in India, Allegro MicroSystems aims to bring innovative products to market faster and more efficiently. The collaboration will also focus on addressing key industry trends, including the increasing demand for magnetic sensors in electric vehicles, the rise of high-power devices such as SiC and GaN and the growing importance of embedded systems and platforms.

“India’s rapidly growing automotive market presents a tremendous opportunity for Allegro MicroSystems,” said Vineet Nargolwala, CEO of Allegro MicroSystems. “This CoE established with Cyient’s partnership, will enable us to accelerate innovation in magnetic sensors and power semiconductors, delivering cutting-edge solutions that address the evolving needs of the automotive industry. This investment reinforces Allegro MicroSystems’s commitment to driving e-mobility, clean energy and automation forward, aligning perfectly with our vision for a safer, more sustainable and autonomous future.”

“Our relationship with Allegro MicroSystems has flourished over the past two years and we are incredibly proud of the team and the contributions they have made to Allegro MicroSystems’s product portfolio. Semiconductors are at the heart of innovation across industries and this CoE strengthens Cyient’s position as a leading partner for companies seeking to develop and manufacture cutting-edge semiconductor products,” said Krishna Bodanapu, executive vice-chairman & anaging director, Cyient.

This collaboration marks a significant milestone for both companies, reinforcing their commitment to driving innovation in the automotive semiconductor market. The CoE will not only contribute to the growth of the semiconductor industry in India but also support the global automotive industry’s transition towards a more sustainable and technologically advanced future.

For more information, visit cyient.com.

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A key plank in the Donald Trump election platform was the widespread implementation of tariffs on goods imported into the United States. Historically, tariffs have been a popular strategy to boost domestic employment, but the globalized supply chains over the last 30 years have changed the way most production goods are manufactured. What happens to the cost of US production if critical inputs face tariffs?

A test case may be the Boeing 787 Dreamliner, a major commercial aircraft program which was designed from the outset to have a widely distributed supply chain of major assemblies, with Boeing acting as an integrator and final assembler of those components. Special exemptions will likely be built into any tariff policy for American firms building globalized products. 

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