Renishaw’s TEMPUS technology, a new scanning algorithm for the RenAM 500 series of metal additive manufacturing (AM) systems, significantly boosts productivity without sacrificing part quality. This innovative technology enables the system’s lasers to fire while the powder recoater is still in motion, cutting up to nine seconds of build time from each layer. Given that builds often consist of thousands of layers, TEMPUS technology can reduce total build times by up to 50%, dramatically enhancing efficiency and throughput in high-volume production environments.

“We are thrilled to add support for Renishaw’s Tempus technology within our LPBF Pro platform. At Dyndrite our aim is to turbocharge our OEM partners’ hardware with advanced software. As we better integrate with hardware our customers benefit more and more from an optimized solution,” said Steve Walton, head of product at Dyndrite. “This integration enables the industry to achieve new levels of price and performance, opening 3D metal printing to new applications in additive manufacturing.

By integrating support for Renishaw’s Tempus technology, Dyndrite’s LPBF Pro empowers RenAM 500 series users with scriptable CAD-to-Print automation, advanced toolpathing tools for complex materials and process development, and streamlined quality and process controls. Through Dyndrite’s advanced toolpath control, users can print challenging parts—such as thin walls, cantilevers, and domes— while ensuring repeatable quality, and minimizing human error.

It also enables organizations to codify their additive manufacturing expertise, ensuring a smooth transition from development to full-scale part production. Dyndrite aims to further push the boundaries of what is possible with Tempus for large parts and geometric features through its combined solution.

“Renishaw’s Tempus technology is designed to push the boundaries of LPBF printing, and we’re excited to see it paired with Dyndrite’s powerful software capabilities,” said Kevin Brigden, applications engineering manager at Renishaw. “This collaboration continues to provide users with an even more efficient, reliable, and streamlined additive manufacturing process, making high-performance 3D printing accessible to a broader range of applications.”

If you’re a Renishaw user and interested in Dyndrite LPBF Pro, click here for more information.

For more information, visit dyndrite.com.

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Rapid Fusion, which employs eight people at its recently opened Exeter R&D center, has created a high-performance electro spindle that will provide precision milling and post-processing of polymer 3D prints.

Eight months in gestation, the breakthrough technology will be fitted to future ZEUS 3D robotic systems by the company and will give clients the opportunity to enjoy the speed of additive manufacturing with the precision of subtractive machining – all in one 6-metre x 6-metre cell.

This tool will be ideal for high-quality molds across a range of industries, such as automotive, aerospace and marine applications, where speed to market is increasingly important.

“This CNC milling tool has the potential to be a real game changer for manufacturers and has been designed in partnership with a number of end users to ensure we deliver exactly what they need,” explained Martin Jewell, R&D director at Rapid Fusion. “3D printing can give unrivalled speed and creates molds near net shape, within 3 to 4mm. Certain applications need even greater precision and this is where you can call in a CNC milling tool to remove the excess material. Going forward, we’ll be able to offer this in one turnkey solution.”

He went on to add: “The advantages are huge. We now know we can deliver repeatable quality, and, on one trial project, we reduced the lead time for a mold tool from six to eight weeks to just five days. That is some saving.

“Our CNC milling tool comes equipped with a tool changer, allowing users to swap between it and the 3D printing pellet extruder on a robot set-up. It can also efficiently handle engineering-grade materials, such as glass and carbon-filled PEI and peek polymers.”

Rapid Fusion, a sister business of 3D printing hardware specialist EVO 3D, is committed to becoming a major player in additive manufacturing platforms – all designed, built and assembled in the UK.

It launched its first bespoke cell, Apollo, earlier this year and this has already received significant interest for its ability to offer faster speeds than existing FDM printers (nearly 200 times quicker).

The company is just a few months away from releasing a second cell that will include the CNC milling tool, with orders already placed by a 3D printing production specialist in the UK and a construction supplier in the EU.

It is estimated that this new technology alone could generate up to £3M of annual revenue and is completely designed, developed and manufactured in the South West.

Martin continued: “Everyone knows the UK is a fantastic breeding ground for ideas and innovation, yet we don’t commercialize enough of the new things we come up with. We’re trying to change this and the CNC milling tool will be an important weapon in our product portfolio for achieving that.

“When integrated into our new robotic platform, clients will be able to tap into the best of additive and subtractive manufacturing in one solution, benefitting from a host of time, cost and operational benefits – not to mention significant environmental savings from using less material and energy.”

Rapid Fusion used the recent Advanced Engineering Show in Birmingham to sign a distribution agreement with CNC World, which will be one of the main agents for the CNC milling tool and the new robotic platform when it is released.

For further information, please visit rapidfusion.co.uk.

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InP technology supports modulator bandwidths exceeding 120 GHz, making it the optimal solution for next-generation multi-terabit telecom and datacom standards – pushing transceiver speeds far into the terabit realm. In contrast, market leading silicon photonics technologies hit a performance ceiling at around 70 GHz. The collaboration aims to deliver scalable, high-volume solutions that combine the best of both technologies.

By co-optimizing silicon photonics, InP, and MTP technologies to fulfill customer requirements, the collaboration will enable new functionalities and improved system performance while reducing integration costs through relaxed photonics packaging requirements. The MTP technology, licensed from X-Celeprint, enables a broad degree of freedom for the system and product designers, by providing flexible integration of various material system chiplets into the product design.

Johan Feenstra, CEO of SMART Photonics, explains: “I am very pleased that we were able to establish a strategic collaboration with X-FAB to unite the strengths of our platforms through world-class heterogeneous integration. As the demand for integrated photonics rapidly increases, thanks to the growth of AI and data transfer, our joint solutions will enable much faster data rates while reducing overall power consumption, and therefore the environmental footprint.”

Rudi De Winter, CEO of X-FAB, adds: “Through heterogeneous integration, we are combining the best of the InP and silicon photonics worlds. This will allow our customers to develop innovative solutions addressing the societal challenges of our times such as decarbonization. It is also a great opportunity to build a strong European value chain.”

This collaboration builds upon the PhotonixFAB EU funding project, which aims to provide a path to scalable high-volume manufacturing for SOI and SiN silicon photonics, MTP-ready InP chiplets and micro-transfer printing of chiplets.

X-FAB and SMART Photonics recently signed a Memorandum of Understanding to formalize their collaboration. The aim is to support lead customers with industrial prototyping by 2026, with risk production readiness by 2027. Early customer engagements can be supported within the ongoing PhotonixFAB project framework.

For more information, visit xfab.com.

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Siemens will deliver NX X software on Azure, so organizations can benefit from Microsoft’s responsible AI tools and access to enterprise-grade security combined with Siemens’ leading product engineering software. This follows the announcement earlier this year of Siemens’ Teamcenter X software for product lifecycle management (PLM) being made available on Azure.

“Our customers are continuing to ask Siemens to bring our industry leading industrial software to Azure,” said Bob Haubrock, senior vice president, Product Engineering Software, Siemens Digital Industries Software. “Our relationship with Microsoft is now more than 35 years and we are pleased, once again, to expand this collaboration so we can best enable our customers to digitally transform through our joint solutions. Building on the success we are seeing with delivery of Teamcenter X on Azure, we’re now expanding to also bring our industry leading NX X product engineering software to the Azure platform.”

Delivering NX X through Azure

A cornerstone of the Siemens Xcelerator as a Service cloud-based portfolio of industry software, NX X delivers industry leading product engineering capabilities as-a-service for advanced 3D product engineering, enabling customers to free up resources, so they can scale and focus on innovation. NX X delivers centralized cloud license management, configuration, and provision of capability while simplifying IT requirements. NX X seamlessly integrates with Azure Cloud Services, giving organizations the flexibility to either install NX X directly on desktops or access it through virtual desktop solutions, including Azure Virtual Desktop, when needed – maximizing flexibility for distributed teams and enabling them to work efficiently from any location. Through multi-session hosting and GPU partitioning as offered on Azure, NX X on Azure becomes even more cost effective.

Enhancing NX X with AI

Unveiled in advance of Microsoft Ignite 2024 and part of the Siemens Industrial Copilot ecosystem, Siemens’ NX software for product engineering will leverage the power of Phi-3, part of Microsoft’s family of small language models, to enable users to ask natural language questions, access detailed technical insights and streamline complex design tasks for faster and smarter product development. Additionally, with advanced capabilities like Retrieval-Augmented Generation (RAG) and Domain Specific Language (DSL), the adapted AI model enables users to ask natural language questions, access detailed technical insights and streamline complex design tasks for faster and smarter product development.

The new NX X AI capability builds on the robust foundation of AI functionality in NX X by recommending solutions based on best practices, generating code to automate design tasks, and finding problem areas, all driven with natural, human-like interaction. Not only does this reduce errors and rework, but it also significantly cuts design time by learning from the user and automating repetitive tasks.

“Microsoft is pleased to expand our long-standing collaboration with Siemens, underscoring AI’s role in driving innovation, operational efficiency, and digital transformation in the industrial sector,” said Satish Thomas, corporate vice president, Business & Industry Solutions, Microsoft. “Through the availability of Siemens’ NX X software on Azure and the integration of its adapted AI model, powered by Microsoft Phi-3, into their copilot, Siemens and Microsoft are equipping engineers with cloud-based AI solutions to simplify complex challenges and drive productivity.”

Siemens Xcelerator enables companies to create the most comprehensive digital twin, and this process often begins with NX X. NX X seamlessly integrates with solutions across the Siemens Xcelerator portfolio, from concept to design to simulation and manufacturing, across disciplines and managed by Teamcenter X. Through the ongoing collaboration between Siemens and Microsoft, NX X adds robust automation and knowledge to the design stage, resulting in a better digital twin with fewer errors in less time than ever before.

NX X on Azure will be available on the Microsoft Azure marketplace.

For more information, visit sw.siemens.com.

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The challenges of engineering talent shortages, supply chain uncertainties and the increasing complexity of designs in the electronic systems design industry have impacted engineers and the development ecosystem, hindering their ability to meet the demands of modern electronics development.

Siemens’ next-generation electronic systems design solution aims to address these challenges head-on by delivering an intuitive, AI-enhanced, cloud-connected, integrated and secure solution to empower engineers and organizations in this dynamic environment.

“We are thrilled to announce the release of our next-generation electronic systems design solution, tailored to meet the critical needs of today’s electronics engineers and the wider engineering community,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “This release represents our most thoroughly vetted solution to date, incorporating feedback from hundreds of participants. By unifying the Xpedition, HyperLynx, and PADS Pro environments and infusing this with AI, our customers will be ready to tackle their challenges head-on.” 

Focused on providing highly intuitive tools to overcome talent shortages and enable engineers to quickly adapt with minimal learning curves, the next generation toolset adds predictive engineering and new support assistance using AI, enhancing engineers’ capabilities, streamlining, and optimizing their workflows. Cloud connectivity will facilitate collaboration across the value chain and provide access to specialized services and resources, enabling engineers to rapidly adapt to changing requirements, supply chain insights and easier collaboration with stakeholders, regardless of location. 

An integrated and multidisciplinary approach is vital for maximizing efficiency and productivity. Siemens’ next-generation solution will facilitate the seamless flow of data and information throughout the product lifecycle using digital threads. This integration fosters collaboration, informed decision-making, and optimized designs. 

“We are delighted to have collaborated with Siemens, providing feedback as an active user as they have developed this next-generation toolset,” said Tom Pitchforth, vice president of Electronics Engineering at Leonardo. “Siemens has been a critical partner for us for over 20 years, and it is essential that our toolset providers align with our future needs, particularly in a rapidly changing and complex landscape. Our primary goals in leveraging the new toolset capabilities include strategic objectives, such as enabling organizational flexibility, and tactical objectives, such as achieving rapid time-to-productivity.  

The next generation software also brings enhanced integration with Siemens’ Teamcenter® software for product lifecycle management and NX software for product engineering, allowing for multi-BOM support and tighter collaboration between ECAD and MCAD domains. To prioritize security, it offers rigid data access restrictions that can be configured and geo-located, while adhering to the strictest industry protocols. Siemens maintains partnerships with industry-leading cloud providers to ensure robust security measures. The solution also includes design and verification requirements management for model-based systems engineering support. 

Siemens’ next-generation electronic systems design solution, including Xpedition NG software and HyperLynx NG software are now available, and PADS Pro NG software will be available in the second quarter of 2025.  

To learn more about Electronic Systems Design software from Siemens, visit eda.sw.siemens.com/en-US/pcb/.

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HxGN Alix is the latest addition to Hexagon’s portfolio of AI technologies, empowering enterprises to enhance operational efficiency, safety and resilience through real-time data insights and predictive analytics. The AI assistant seamlessly integrates with Hexagon’s comprehensive Digital Backbone, which connects data, workflow processes and information systems across industrial facilities.

HxGN Alix is available in the latest release of HxGN EAM, with future availability across the Hexagon Asset Lifecycle Intelligence division portfolio to come in 2025.

Asset-heavy industries, along with enterprises with complex, globally dispersed operations and supply chains, are grappling with several challenges, including replacing aging physical assets and infrastructure; modernizing legacy processes and systems to enable more digitally connected, AI-powered capabilities to make physical assets smarter, more resilient and sustainable; and protecting against cybersecurity threats that could cripple entire supply chains. To date, the deployment of AI solutions at scale has been hindered by communication gaps between stakeholders and technical teams, infrastructure limitations and change management hurdles.

With robust data security protocols and an emphasis on data accuracy, HxGN Alix minimizes your risk exposure while delivering accurate, high-performance results.

Easily accessible from within Hexagon solutions, HxGN Alix serves as an intelligent advisory system, offering personalized, dependable support comparable to human expertise while acting as a key player in breaking down information silos.

“HxGN Alix represents a significant leap forward in how industrial enterprises manage and optimize their assets,” said Javier Buzzalino, senior vice president solution development, Hexagon’s Asset Lifecycle Intelligence division. “By embedding AI-driven insights into daily operations, we’re empowering organizations to predict and prevent issues before they arise, enhance worker productivity, and ultimately, make industrial facilities safer and more efficient. HxGN Alix exemplifies Hexagon’s commitment to delivering pragmatic, data-secure solutions that address the evolving needs of our customers in asset-heavy industries.”

As the industrial sector looks for ways to build more resilient and sustainable operations, Hexagon has positioned itself as a trusted partner to implement AI-led, digital transformation projects. From energy companies managing asset lifecycles to construction firms improving operational efficiencies, Hexagon offers the cutting-edge technology needed to thrive in complex, globally dispersed environments.

For more information, visit hexagon.com. 

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With support and additional services provided by Ansys Apex Channel Partner ESSS, WEG is pioneering a new path forward by introducing axial flux motors to the industrial equipment market. Axial flux motors offer a more optimized and efficient alternative to radial flux motors due to their higher power density and specific torque. Some resulting advantages include space and weight savings, high efficiency levels, and improved durability for a reliable product lifespan.  

For instance, a standard industrial induction motor with a power output of 220 kW can weigh up to 1,498 kg. Using Ansys solutions, WEG reduced the weight of this model to 139 kg. Furthermore, with advanced numerical data, WEG achieved an ultra-compact design weighing 51 kg while maintaining performance power in both cases. The higher power density of this technology reduces the amount of raw material significantly, shaving downstream logistical costs like shipping and lowering CO₂ emissions. This demonstrates WEG’s commitment to sustainability, efficiency, and innovation. 

WEG leveraged multiple Ansys multiphysics simulation solutions for W80 AXgen, including:

• Ansys Fluent fluid simulation software to determine optimal liquid coolant circulation paths for heat management
• Ansys Electronics simulation solutions to design and test the magnets that spin the rotors, calculating important parameters of an electrical machine, such as the electromagnetic torque and efficiency
• Ansys Mechanical finite element analysis software to understand and refine materials load, impact, and stress factors that are central to manufacturing
• Ansys Granta materials information, selection, and data management to quickly identify the most suitable material for a motor with high power density  

“With Ansys’ powerful simulation tools and ESSS’ excellent support, we have conducted extensive multiphysics validations in a virtual environment, leading to the successful development of advanced products like the W80 AXgen,” Cassiano Antunes Cezario, R&D manager at WEG. “Ansys simulation provides the ideal balance between speed and reliability — giving us confidence that our products will be durable and perform to our customers’ expectations. We are committed to efficiency, which makes using Ansys simulation an easy yet crucial choice.”

The WEG W80 AXgen is available from 5.5 kW to 220 kW in a single configuration and up to 440 kW when taking advantage of the stackable configuration.

“Ansys simulation helps customers like WEG compete in the marketplace,” said Prith Banerjee, chief technology officer and executive sponsor of sustainability programs at Ansys. “We have been working diligently for over 50 years to refine our leading numerical simulation technology, and now decades of materials research is catching up. This is the perfect combination for our customers — new materials poised for innovative applications coupled with Ansys simulation solutions that deliver pervasive physics-based insights for more efficient, powerful, and resilient products.”

For more information, visit ansys.com.

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The Siemens Industrial Copilot for Engineering is the only copilot currently on the market that writes code for automation engineering. Future capabilities include multimodality and agent concepts, which will make it even more valuable for engineers. To deliver full data sovereignty, the Siemens Industrial Copilot for Operations is planned to be offered as an on-premises hardware-software bundle.

Rainer Brehm, CEO Factory Automation at Siemens, said: “With Siemens’ domain expertise, we’re turning generative AI into industrial-grade solutions that can be deployed without specialized AI expertise. The Siemens Industrial Copilot, the first generative AI-powered product for automation engineering, is a supercharger for industrial automation and will accelerate our customer’s journey toward greater innovation, productivity, and competitiveness.”

thyssenkrupp Automation Engineering and Siemens Electronics Factory to roll out the Siemens Industrial Copilot

Competitive pressure and lack of skilled labor are major challenges for industrial companies today. Making generative AI industrial-grade and bringing it to the shopfloor holds a huge potential for overcoming current industrial challenges and improving productivity. In fact, according to a recent Gartner report, by 2028 75 percent of developers will regularly use generative AI to assist with code creation, up from less than 10 percent in early 2023.

thyssenkrupp Automation Engineering, a special machine and plant builder, integrated the Copilot for Engineering in a battery machine used for battery quality inspections on electric cars. The industrial company plans to use the genAI-powered assistant at scale – engineering the machines at thyssenkrupp’s global locations from 2025 onwards. The Industrial Copilot assists thyssenkrupp engineers in creating TIA Portal projects. It helps them develop structured control language (SCL) code faster for programmable logic controllers (PLCs), intelligently integrates the code into the TIA Portal and generates a machine visualization in WinCC Unified. This allows engineering teams to reduce repetitive and monotonous tasks like automating data management and sensor configuration. They can work more efficiently, optimize processes, and drive innovation.

“thyssenkrupp Automation Engineering and Siemens have been successfully working together for a long time,” said Dr. Rolf-Günther Nieberding, CEO of thyssenkrupp Automation Engineering. “I expect that rolling out the Siemens Industrial Copilot across our machines will help us – and therefore our customers – to implement demanding projects in a much shorter time.”

The Siemens Electronics Factory in Erlangen, Germany, implemented the Copilot for Operations across its soldering machines. The Industrial Copilot helps Siemens operators and maintenance engineers to understand a machine’s error codes by translating its messages into natural language. It suggests solutions based on the machine’s details and history by combing through different documents, manuals, and spare part lists. Machine downtime can be significantly reduced, production bottlenecks can be resolved faster, and shift handovers will work more efficiently.

Multimodality, agent concepts and on-premises approach to supercharge the Siemens Industrial Copilot

The development of expanded and more powerful functionalities for the Siemens Industrial Copilot has been instrumental in winning thyssenkrupp Automation Engineering as a customer.

The Industrial Copilot for Operations allows shopfloor workers to directly interact with machines and helps them with maintenance tasks, error handling and performance optimization. In addition, the Industrial Copilot will have multimodal capabilities to analyze and interpret images and drive even more productivity with agent-based automation for a variety of tasks. To address data security for customers and make sure that data doesn’t leave the shopfloor, the Industrial Copilot for Operations is planned to be offered as an on-premises hardware-software bundle with the Simatic Industrial PC (IPC 1047E). The software stack running on IPCs is powered by NVIDIA NIM microservices, part of the NVIDIA AI Enterprise software platform, which lets automation and maintenance engineers ask real-time queries about operational and document data to facilitate rapid decision-making and reduce machine downtime. This configuration doesn’t require an Internet connection and stores data on local hardware devices. It helps ensure data security by processing all data right on the shopfloor and keeping customers’ data stored and available when and where it’s needed.

The Industrial Copilot for Engineering will support multimodal input: for instance, by detecting and converting manual changes in the ECAD document that’s used for electrical planning. These changes are automatically highlighted, annotated and eventually implemented in the TIA Portal project.

Highly complex automation projects will be partially automated using agent concepts. Agent concepts go beyond simple question-and-answer interactions, automating processes by breaking down large, complex tasks into subtasks. All relevant information is then collected from a number of sources, including ECAD information, in order to understand the user goal. Agents can also be connected to external systems and sources, which creates a closed loop with different tools linked together. Next, the agents create a plan on how to achieve goals and execute the required actions independently. These range from sending messages and accessing external systems to updating data sets. Engineers can also use agents to control and direct all production processes – while maintaining full transparency, having an overview of the data and knowing which steps should be taken next.

The Engineering Copilot TIA Essential has been available on the Siemens Xcelerator marketplace since July 2024. While Siemens provides the automation elements of the Industrial Copilot, the natural language processing is carried out by one of the most powerful GPT models using the Azure OpenAI Service of the Microsoft Cloud. This enables enterprise-grade performance, data protection, and reliability. Siemens’ generative AI solutions for industry are reliable, secure and trustworthy, thus making industrial AI accessible to everyone, anywhere, at any time.

For more information, visit siemens.com.

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Ten selected participants will receive the NXP FRDM MCX A15X kit and will tackle a building automation problem. Suggested projects include, but are not limited to:

• Smart Temperature Control System
• Bluetooth Lighting Controller
• Attendance and Presence Monitoring
• Meeting Room Booking System
• CO2 Monitor
• Foot Traffic Monitoring System

Applications are open until Dec 16, and the chosen challengers will be announced on Dec 20. Participants will then have until Mar 7, 2025 to complete their projects and document their journey through blog posts on the element14 Community platform.

Challengers will compete for a range of exciting prizes. The grand prize and runner-up winners will receive a Nest Home Automation Kit, CCTV system, and Multicomp Pro Multimeters. To be eligible, participants must share regular updates and document their build process, culminating in a final showcase of their Building Automation Project.

Andreea Teodorescu, global director of product marketing & element14 Community stated, “We’re thrilled to join forces with NXP to inspire engineers and tech enthusiasts to push the boundaries of building automation. This challenge provides a unique opportunity to leverage NXP’s advanced FRDM MCX A15X development kit and transform spaces through innovative, practical solutions. We look forward to seeing how participants bring their creative ideas to life, shaping the future of smart spaces.

The online hackathon-style design challenge was officially launched at element14 Community’s stand at Farnell’s exhibit within Avnet City during electronica 2024, encouraging attendees to learn more and get involved.

For those attending electronica, element14 Community is hosting Student Day, sponsored by Multicomp Pro, on Friday 15 November. Students and educators are invited to visit the Farnell booth throughout the day to discuss the free technical resources the element14 community has to offer and pick up exclusive giveaways.

For more information and to register for the design challenge, visit community.element14.com/SmartSpaces.

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Dr. Yoav Zeif, Stratasys’ chief executive officer, stated, “Our decisive actions to realign our business with current market realities are starting to yield results. We have successfully begun to transform the company through cost optimization and by focusing on higher-growth opportunities. Our flagship F3300 platform is gaining significant traction in the marketplace, while our expansion into our key target industries of aerospace, automotive and healthcare continues to expand. Most importantly, we returned to non-GAAP profitability in the third quarter, overcoming ongoing revenue pressures, further demonstrating the effective execution of our business plan by our entire team.”

Dr. Zeif continued, “The fundamental strength of our business is evident in our improved margins and continued robust balance sheet. Our recurring revenue from consumables continues to grow, particularly in FDM technology utilization for manufacturing purposes, partially offsetting hardware sales that remain impacted by macro conditions. This validates both our recurring revenue model and our customers’ accelerating shift from prototyping to manufacturing applications. With our restructuring plan ahead of schedule and on track to deliver $40 million in annual cost savings starting in the first quarter of next year, we are well-positioned to deliver increased revenue growth, profitability and cash flow in 2025, to address the pent-up demand once market conditions improve.”

A complete chart of the financial results is available here.

To learn more about Stratasys, visit stratasys.com.

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